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Features of InkTec’s TEC (TEC Transparent Electronic Cunductive)

TEC was developed through the manufacturing process of soluble silver clusters, as opposed to the existing conductive ink that disperses nano particles. When the metal (Ag) is dissolved in solvent, it appears to be a clear liquid without particles, but after printing and heat treatment process, a high-density silver layer with superior conductivity is formed.

It is clear with no concept of particles (sub-nano), has excellent stability, and enables low-temperature sintering and thin film materialization to be applied in various areas of the electronic parts material industry.

The Formation Process

of the Thin Film of TEC Ink

Click to watch video

InkTec’s Materials for Printed Electronics

Based on InkTec’s own TEC ink, InkTec has been developing and supplying various materials with specialized printing methods and applicable products, and with decades of accumulated technical skills, we are capable of free viscosity control and optimum response to customers’ needs. The materials currently manufactured and distributed by InkTec are in the forms of Ag Cluster Complex based on TEC Ink. There’s also the paste form using nano dispersion and nano powder and flakes, and a hybrid form using Ag complex and Nano/Flake, which are applied in diverse printing processes, such as inkjet, screen, spray, and roll to roll-based printing (Gravure, Flexo, gravure offset, etc.) They are also used for functional purposes (optical products / decoration) in addition to general electrodes.

Conductive Paste / inkmore information

Product Class	Process method	Material type	Main components	Applicables
PA series	Flat screen, imprinting, EHD, pad, Gravure offset	Conductive paste (High viscosity)	Ag powder	TSP Bezel, Health care, Sensor, Display, Smart Label, Wearable, Membrane, etc.
LT series	Screen printing after exposure & devolopment (Photolitho graphic)	Conductive paste (High viscosity)	Ag powder	Passive component (Inductor, LTCC, etc.) Photosensitive inner electrode
LD series	Screen printing after exposure & development (Photolitho graphic)	Dielectric, Insulation paste (High viscosity)	Ceramic powder	Passive element (Inductor, LTCC, etc.) Photosensitive inner electrode
DP series	Dipping	Conductive paste (High viscosity)	Ag nanopowder	Passive element (Inductor, MLCC, etc.) Curable external electrode
Co series	Coating(Spray/ Spin, etc)	Ink (low viscosity)	Silver ion complex (Ag complex)	Mirror effect (conductive)
IJ series	Inkjet (Aerosol, Electrostatic, etc)	Ink (low viscosity)	Silver ion complex (Ag complex)	General electrode by Inkjet Printing
PR series	Gravure, Flexo, Slot die	Ink (low viscosity)	Ag nanopowder	General electrodes and coating
EMI series	Dispensing nozzle	Ink (low viscosity)	Ag nanopowder Silver ion complex	Semiconductor and EMI Shielding

Conductive Ag nanopaticle

Product Class	Particle size	Material type	Ag concentration (wt%)	Application
NP20	≒ 20nm	Wet cake	85 ~ 90	Low temperature sintering type, Higt electrical conductivity, Thermal conductivity , Electrode material for flexible printing electronics
NP20D (Dispersion)	≒ 20nm	Disperse emulsion	40 ~ 80	Same as NP20

※Contact : E-mail ei@inktec.com TEL +82-31-490-6422

Items		TEC-PA-051	TEC-PA-070	TEC-PL-010	TEC-PA-060	TEC-PA-088	TEC-PK-170BS
Process	Screen	●	●	●	●	●	●
	Screen + Laser patterning				●	●
	Dispensing					●	●
Available Line Width		≧60㎛	≧80㎛	≧80㎛	≧30㎛	≧15㎛	≧150㎛
Viscosity @ 20rpm		185,000cps	125,000cps	130,000cps	77,000cps	45,000cps	50,000cps
Curing Temp.		130℃ x 20min.	130℃ x 20min.	100℃ x 30min.	130℃ x 20min.	130℃ x 20min.	130℃ x 10min.
Volume Resistivity (Max)		6.0 X 10^-5 Ωcm	3.0 X 10^-4 Ωcm	8.0 X 10^-5 Ωcm	6.0 X 10^-5 Ωcm	6.5 X 10^-5 Ωcm	3 X 10^-2 Ωcm
Adhesion		5 ~ 4B	5 ~ 4B	5 ~ 4B	5 ~ 4B	5 ~ 4B	5 ~ 4B
Substrate		ITO, PET, Glass, Paper, ETC	ITO, PET, Glass, Paper, ETC	ITO, PET, Glass, Paper, ETC	ITO, PET, Glass, Paper, ETC	ITO, PET, Glass, Paper, ETC	ITO, PET, Glass, Paper, ETC
Advantages		●Fine resolution stability over 60㎛ line width ●Excellent adhesion on ITO/PET film	●Cost effectiveness ●Less consumption ●Stability over 70㎛ ●Excellent Adhesion	●Low Temp curing ●Prevent film shrinkage of substrate by heating	●Stability over 30㎛ by laser process ●Excellent adhesion on ITO /PET film	●Fine Patterning less than 20㎛ line width ●Thin layer ≤5㎛ ●Low consumption	●Cost effectiveness lowe resistivity carbon paste ●Excellent workability ●Good uniformity

Items		TEC-LT-010	TEC-LD-017	TEC-DP-S10
Process	Screen Printing	●	●
	Photolithographic	●	●
	Dipping			●
Available Line Width		≧20	20	Depend on process
Viscosity @ 10rpm		15,000	11,000	33,000
Curing Temp.		60℃ X 5~10min (firing 600℃~900℃)	65℃ X 5~10min (firing 800℃~900℃)	100℃ X 10min (after 250℃ X 1H)
Volume Resistivity		2.2 X 10^-6 Ωcm ( after firing)	-	2.0x 10^-5 Ωcm
Adhesion		5 ~ 4B	5 ~ 4B	5 ~ 4B
Substrate		Ceramic Green sheet, Ceramic substrate, Ceramic paste, Alumina substrate, Ferrite Green sheet, Ferrite paste	For Inductor/LTCC body, Insulation layer	Inductor/LTCC/MLCC body
Advantages		●Fine Patterning Less than 20㎛ ●high thickness ≥15㎛ ●Lowest Resistivity, Low RDC	●Fine via hall less than 30㎛ ●Firing thickness ≥10㎛	●One dipping process ●Low RDC ●High density electrode

Items		TEC-IJ-010	TEC-PR-041	TEC-CO-011	TEC-CO-021	TEC-EMI-050
Process	Inkjet	●
	Spray			●	●	● (Dispensing type spray)
	Dispensing		●
	Roll to Roll (Flexo, Gravure, Slot Die, Etc.)		●	●	●
Available Line Width		Depend on process
Viscosity @ 20rpm		9~15cps	5~15cps	< 400cps	10~20 cps	50~60 cps
Curing Temp.		130℃ X 5~10min	130℃ X 5~10min	130℃ x 20min.	120℃ X 10min	150℃ X 30min
Volume Resistivity		4.2 X 10^-6 Ωcm	8.3 X 10^-6 Ωcm	10 X 10^-6 Ω㎝	6.0 X 10^-6 Ωcm	8.0 X 10^-6 Ωcm
Adhesion		5 ~ 4B	5 ~ 4B	5 ~ 4B	5 ~ 4B	5 ~ 4B
Substrate		PET, Primer coated substrate	ITO, PET, Glass, Paper, ETC	ITO, PET, Glass, Paper, ETC	PET, Primer coated substrate	EMC
Advantages		●Lowest resistivity ●No head clogging ●Inkjet printing available	●Excellent resistivity ●No head clogging ●Excellent Adhesion ●Inkjet printing available	●Excellent resistivity ●R2R printing available ●Excellent Adhesion	●Mirror or metal decorative effect for home appliance & etc. ●Also has electrical performance	●Excellent EMI shielding property (≒ 70dB@1.5Ghz)